Heat disspation device

ABSTRACT

A heat dissipation device includes a substrate, a heat sink arranged on the substrate, and a heat pipe. The substrate includes a bottom plate, a cover, and a supporter sandwiched between the bottom plate and the cover, a receiving chamber being defined by the bottom plate, the cover and the supporter cooperatively. The heat pipe includes a U-shaped evaporation section received in the receiving chamber, a condensation section outside the receiving chamber, and a connection section interconnecting the evaporation section and the condensation section.

BACKGROUND

1. Technical Field

The present disclosure generally relates to heat dissipation devices.

2. Description of Related Art

During operation of electronic devices such as computer central processing units (CPUs), a large amount of heat is often produced. The heat must be quickly removed from the electronic devices to prevent them from becoming unstable or being damaged. Heat dissipation devices are employed to dissipate heat produced by the electric device. A heat dissipation device generally comprises a base attached to the electric device, a plurality of fins thermally connected to the base by heat pipes, and a fan for driving airflow towards the fins. However, the base is usually configured as a solid plate, which is disadvantageous to lightweight development tendency of electrical devices.

Therefore, what is needed is to provide a heat dissipation device capable of overcoming above shortcomings

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the disclosure.

FIG. 1 is an isometric view of a heat dissipation device in accordance with an embodiment of the present disclosure.

FIG. 2 is an exploded view of the heat dissipation device of FIG. 1.

FIG. 3 is an exploded view of the heat dissipation device of FIG. 1, shown in another aspect.

FIG. 4 is an exploded view of the heat dissipation device of FIG. 1, shown separated substrate and heat sink.

DETAILED DESCRIPTION

Reference will now be made to the drawings to describe the present embodiment of a heat dissipation device, in detail.

Referring to FIG. 1, a heat dissipation device 100 according to an embodiment includes a substrate 10 and a heat sink 20. The heat dissipation device 100 is for attaching electrical devices, thereby dissipating heat generated by the electrical devices.

Referring to FIG. 2 to FIG. 4, the substrate 10 includes a bottom plate 11, a cover 12, a supporter 13 sandwiched between the bottom plate 11 and the cover 12, and two heat pipes 14.

The bottom plate 11 includes a main body 111 and two opposite lateral walls 112. The main body 111 is used for attaching electrical devices (not shown). In this embodiment, the main body 111 has a generally square shape. A plurality of through holes 113 is formed at corners of the bottom plate 11. In this embodiment, there are four through holes 113 formed at four corners of the bottom plate 11, respectively. The number and the position of the through holes 113 can be adjusted according to actual requirement. The two lateral walls 112 each extend upwardly from an edge of the main body 111, along a direction perpendicular to the main body 111.

The cover 12 is a thin sheet with two opposite flat surfaces. In this embodiment, the cover 12 has a thickness no more than 0.8 millimeters (mm). The cover 12 is parallel to the main body 111. The cover 12 includes two notches 121 defined at two opposite later sides thereof. The two notches 121 are configured for the heat pipes 14 extending therethrough. Further, the cover 12 includes four through holes 123 formed at four corners thereof. The four through holes 123 of the cover 12 are respectively corresponding to the four through holes 113 of the bottom plate 11.

The supporter 13 includes a first shoulder 131 and a second shoulder 132 opposite to the first shoulder 131, both of which are elongated. The first and second shoulders 131, 132 are arranged between the cover 12 and the bottom plate 11. The first and second shoulders 131, 132 are arranged at another two opposite edges of the main body 111 and perpendicular to the lateral walls 112. The first and second shoulders 131, 132 each have two distal ends abutting against the two lateral walls 112. The first and second shoulders 131, 132 each have a height as same as the height of the lateral walls 112, and a length as same as the side length of the main body 111. As such, the main body 111 and later walls 112 of the bottom plate 11, the first shoulder 131 and the second shoulder 132 of the supporter 13, and the cover 12 cooperatively form a receiving chamber 30 (shown in FIG. 4).

The first shoulder 131 and the second shoulder 132 each have two through holes 133 formed thereon. The total four through holes 133 are respectively corresponding to the four through holes 113 and the four through holes 123. As such, when cooperatively forming the receiving chamber 30, the bottom plate 11, the cover 12 and the supporter 13 are capable of being engaged together by connecting members (not shown), such as bolts, each penetrating through a respective set of the through holes 113, 123 and 133. The receiving space 30 has an internal height as same as the height of the first and second shoulders 131, 132. As such, the first and second shoulder 131, 132 between the cover 12 and the bottom plate 11 performs a supporting function to the cover 12, thereby enhancing mechanical strength of the substrate 10.

The two heat pipes 14 are arranged adjacent to each other. Each heat pipe 14 includes an evaporation section 141, a condensation section 142, and a connecting section 143 interconnecting the evaporation section 141 and the condensation section 142.

The two evaporation sections 141 are received in the receiving chamber 30 and adjacent to each other. Each of the evaporation sections 141 is pressed into plate portion and has a U-shape. The U-shaped evaporation section 141 of the second heat pipe 14 has a first opening direction opposite to a second opening direction of the U-shaped evaporation section 141 of the first heat pipe 14. The U-shaped evaporation sections 141 each have a thickness as same as the height of the first and second shoulders 131, thereby also performing a supporting function to the cover 12. It is to be said that, heat conductive adhesive can also be employed between the contacting surfaces of the U-shaped evaporation sections 141, the main body 111 of the bottom plate 11, and the cover 12. Further, the U-shaped evaporation sections 141 can also be soldered to the main body 111 of the bottom plate 11.

The connecting section 143 of each heat pipe 14 extends upwardly from an end portion 1410 of the corresponding evaporation section 141, and the distal end 1410 is adjacent to the neighboring U-shaped evaporation section 141 of the other heat pipe 14. The connection section 143 of each heat pipe 14 extends outward from the receiving chamber 30, via the notches 121, to contact the corresponding condensation section 142. The two connection portions 143 each have an arc shape and respectively slants to a direction away from each other. An end portion of the connection portion 143 which is connected to the evaporation section 141 has a flat shape, and another end portion of the connection portion 143 which is connected to the condensation section 142 has a column shape.

The condensation section 142 of each heat pipe 14 extends horizontally and parallel to the elongated shoulders 131, 132 from an end portion of the connection section 143, thereby sitting right above the corresponding U-shaped evaporation section 141 of the heat pipe 14. As such, the condensation section 142 and the connecting section 143 sit in a common plane obliquely intersecting a plane where the U-shaped evaporation section 141 sits, thereby enhancing stability of the heat dissipation device 100. Each condensation section 142 has a column shape. A length of each condensation section 142 is equal to the length of the elongated shoulders 131, 132. The condensation section 142 of each heat pipe 14 is inserted inside the heat sink 20, thereby releasing heat to the heat sink 20.

The heat sink 20 includes a plurality of fins 21 arranged on the cover 12, without sheltering the through holes 123 of the cover 12. The plurality of fins 21 is arranged parallel to each other in predetermined interval. A passage 22 for air flow is defined between each two neighboring fins 21. A bottom of the heat sink 20 is thermally connected to the cover 12.

The plurality of fins 21 cooperatively define a through hole 211 with its longitudinal axis perpendicular to the fins 21. The through hole 211 is adapted for insertion of the condensation section 142 of the heat pipe 14. In this embodiment, there are two through holes 211 defined by the plurality of fins 21 adjacent to a top of the heat sink 20 and adapted for insertion of the two condensation sections 142.

Furthermore, the plurality of fins 21 also defines a notch 212 adapted for receiving the connection section 143 of the heat pipe 14. In this embodiment, there are two notches 212 defined at two opposite lateral side of the heat sink 20 for the two connection sections 143.

Due to the substrate 10 being configured hollow to perform as traditional bases for attaching electric devices, a total weight of the heat dissipation device 100 is effectively decreased. At the same time, the shoulders 131, 132 of the supporter 13 and the evaporation section 141 of the heat pipe 14 are all capable of performing supporting function to the cover 12, thereby preventing the substrate 10 from distorting under downward force applied by the heat sink 20.

It is to be understood that the above-described embodiments are intended to illustrate rather than limit the disclosure. Variations may be made to the embodiments without departing from the spirit of the disclosure as claimed. The above-described embodiments illustrate the scope of the disclosure but do not restrict the scope of the disclosure. 

1. A heat dissipation device, comprising: a substrate with a bottom plate, a cover, and a supporter sandwiched between the bottom plate and the cover, a receiving chamber being defined by the bottom plate, the cover and the supporter cooperatively; a heat sink with a plurality of fins arranged on the cover; and a first heat pipe with an evaporation section, a condensation section, and a connection section interconnecting the evaporation section and the condensation section, the evaporation section being U-shaped and received in the receiving chamber, the connection section extending from the receiving chamber outward, the condensation section being inserted inside the heat sink and penetrating through the plurality of fins, the condensation section and the connecting section sitting in a common plane obliquely intersecting a plane where the U-shaped evaporation section sits.
 2. The heat dissipation device of claim 1, wherein the condensation section of the first heat pipe sits right over the U-shaped evaporation section of the first heat pipe.
 3. The heat dissipation device of claim 1, wherein the bottom plate comprises through holes defined at peripheral edge thereof, the cover and the supporter both comprising through holes defined corresponding to the through holes of the bottom plate, the bottom plate, the cover and the supporter capable being engaged together by connecting members each penetrating through a respective one of the through holes.
 4. The heat dissipation device of claim 3, wherein the plurality of fins are arranged on the cover without sheltering the through holes of the cover.
 5. The heat dissipation device of claim 1, wherein the cover defines a notch through which the connection section of the first heat pipe extends outward from the receiving chamber.
 6. The heat dissipation device of claim 1, wherein the supporter includes two elongated shoulders arranged at two opposite peripheral sides of the bottom plate.
 7. The heat dissipation device of claim 1, further comprising a second heat pipe with the same configuration of the first heat pipe, a U-shaped evaporation section of the second heat pipe being received in the receiving chamber, the U-shaped evaporation section of the second heat pipe having an opening direction opposite to the U-shaped evaporation section of the first heat pipe.
 8. The heat dissipation device of claim 7, wherein the U-shaped evaporation sections of the first and second heat pipes sit adjacent to each other, the U-shaped evaporation section of the first heat pipe comprising a first end portion adjacent to the second heat pipe, the connection section of the first heat pipe extending from the first end portion, the U-shaped evaporation section of the second heat pipe comprising a second end portion adjacent to the first heat pipe, the connection section of the second heat pipe extending from the second end portion.
 9. The heat dissipation device of claim 1, wherein the heat sink defines a through hole receiving the condensation section of the first heat pipe.
 10. The heat dissipation device of claim 1, wherein a notch is defined at a lateral side of the heat sink receiving the connection section of the first heat pipe.
 11. The heat dissipation device of claim 1, wherein the bottom plate includes two lateral walls extending upwardly from two opposite edges thereof, each lateral wall extending along a direction perpendicular to the bottom plate.
 12. The heat dissipation device of claim 11, wherein the supporter includes two elongated shoulders arranged at two another two opposite edges of the bottom plate.
 13. The heat dissipation device of claim 12, wherein the two shoulders each have two distal ends abutting against the two lateral walls.
 14. The heat dissipation device of claim 13, wherein the two shoulders are parallel to each other and perpendicular to the lateral walls. 